Effect of current density on the deposit stress in gold electroplating

Author:

Hou Shuangyue1,Xiong Ying1,Chen Shan1,Chen Xiangyu2,Xiong Penghui2,Tian Yangchao1,Liu Gang1

Affiliation:

1. National Synchrotron Radiation Laboratory, University of Science and Technology of China, Hefei 230029, China

2. Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei 230026, China

Abstract

As the key components of grating-based X-ray phase contrast imaging, absorption gratings are essential to be fabricated. In fact, the internal stress is one of the critical issues for the application of the electroplated gold deposit as the absorption metal for absorption gratings. It is common that high internal stress levels can cause the deposit cracking, blistering and peeling away from the substrate material. This study investigates the effect of current density on the internal stress by the bent strip method. The surface morphologies of gold deposits are examined using scanning electron microscopy (SEM) and the crystal structure of the electroplated deposit is analyzed by X-ray diffraction (XRD). The change of current density reverses the internal stress of the deposits from compressive to tensile. The value of deposit stress can be near zero by optimizing the current density.

Funder

National Key Basic Research Program of China

Publisher

World Scientific Pub Co Pte Lt

Subject

Condensed Matter Physics,Statistical and Nonlinear Physics

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