Broadband sound absorption using acoustic black holes with micro-perforated panels

Author:

Meng Daxiang1ORCID,Liang Xiao12ORCID,Liang Haofeng1ORCID,Chu Jiaming1ORCID,Zhou Zhuo3ORCID,Zhou Guojian4ORCID,Duan Jianhong5,Chen Jianwen6

Affiliation:

1. Xiangtan University School of Mechanical Engineering, Xiangtan 411105, China

2. Foshan Green Intelligent Manufacturing, Research Institute of Xiangtan University, Foshan, Guangdong 528311, China

3. School of Mechanical Engineering and State Key Laboratory, for Strength and Vibration of Mechanical Structures, Xi’an Jiaotong University, Xi’an, Shanxi 710049, China

4. Shanghai Research Institute of Materials, Shanghai 200437, China

5. Pingshuo Group Co., Shuozhou, Shanxi 036000, China

6. Jianglu Electromechanical Group Co., Xiangtan 411100, China

Abstract

In order to achieve broadband sound absorption, we propose a composite structure combining acoustic black holes (ABHs) and micro-perforated panels (MPPs). Here, we adopt both simulant and experimental methods to describe the sound transmission mechanism of the proposed composite ABH. This mechanism allows the ABH to have a sound absorption coefficient of over 0.8 in the range of 400–3200[Formula: see text]Hz and above 0.7 between 250[Formula: see text]Hz and 400[Formula: see text]Hz. The total length of the proposed ABH is 155[Formula: see text]mm, in which the thickness of the MPPs is 0.5[Formula: see text]mm, the pore size is 0.3[Formula: see text]mm and the porosity is 0.1 and 0.16, overcoming the length size and bandwidth limit for sound wave suppression in current ABHs. This work can further progress in elucidating the acoustic characteristics of ABH and open new avenues in ultra-broad-band sound wave control.

Funder

The National Science Foundation of China

The Guangdong Basic and Applied Basic Research Fund Regional Joint Fund Youth Fund Project

The Science and Technology Innovation Program of Hunan Province

China Postdoctoral Science Foundation

Natural Science Foundation of Hunan Province Youth Project

Publisher

World Scientific Pub Co Pte Ltd

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