Integrated Optoelectronics Using Thin Film Epitaxial Liftoff Materials and Devices

Author:

Jokerst N. M.1

Affiliation:

1. School of Electrical and Computer Engineering, Microelectronics Research Center, Manufacturing Research Center, Packaging Research Center, Georgia Institute of Technology Atlanta, GA 30332-0250, USA

Abstract

The separation of single crystal thin film epitaxial compound semiconductor layers from a lattice matched growth substrate through selective etching, with subsequent bonding of the epitaxial thin film devices onto host substrates, is an emerging tool for multi-material, hybrid integration. Progress to date in this area, presented herein, includes advanced thin film devices, thin film material separation and device integration processing techniques, and thin film material and device integration with host substrates which include silicon circuitry, polymers, glass, and lithium niobate.

Publisher

World Scientific Pub Co Pte Lt

Subject

Physics and Astronomy (miscellaneous),Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Chip scale integrated microresonators for sensing applications;Laser Resonators and Beam Control X;2008-02-07

2. Chip scale integrated planar photonics;SPIE Proceedings;2008-02-07

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