Study on properties of ultra-low dielectric loss mPPO/MTCLT composites prepared by injection molding

Author:

Liu Yahan1,Peng Haiyi2ORCID,Yao Xiaogang2,Mao Minmin1,Song Kaixin1,Lin Huixing2

Affiliation:

1. College of Electronic Information and Engineering, Hangzhou Dianzi University, 1158 Baiyang Street 2nd Street, Hangzhou 310018, P. R. China

2. Key Laboratory of Inorganic Functional Materials and Devices, Shanghai Institute of Ceramics, Chinese Academy of Sciences, 588 Heshuo Road, Shanghai 201800, P. R. China

Abstract

A novel category of polyphenylene oxide/high-impact polystyrene (PPO/HIPS) alloy was used as the polymer matrix (abbreviated as mPPO) and loaded with different volume fractions (0, 10, 20, 30, 40, 50 vol.%) of MgTiO3–Ca[Formula: see text]La[Formula: see text]TiO3 (abbreviated as MTCLT) ceramics to prepare composites by injection molding. Its micromorphology, density, dielectric, thermal and mechanical properties were analyzed in detail. The experimental results show that the composites possess a compact microstructure because HIPS increases the fluidity of PPO. Due to the excellent dielectric properties of both mPPO and MTCLT, the composites have an extremely low dielectric loss. The realization of the high ceramic filler fraction greatly limits the thermal expansion of the polymer chain by introducing the interphase, so that the coefficient of thermal expansion of the composite material could be as low as 21.8 ppm/[Formula: see text]C. At the same time, the presence of ceramic particles could reinforce the mechanical property of the composites. When the ceramic filler fraction is higher than 20 vol.%, the bending strength of the composite material is around 110 MPa. When the ceramic filler fraction is 40 vol.%, the composite possesses the best comprehensive performance. The dielectric constant is 6.81, the dielectric loss is 0.00104, the thermal expansion coefficient is as low as 25.3 ppm/[Formula: see text]C, and the bending strength is 110.4 MPa. Due to its excellent properties, this material can be a good candidate in the field of microwave communication.

Publisher

World Scientific Pub Co Pte Ltd

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

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