NUMERICAL SIMULATION OF FLOW AND CONJUGATE HEAT TRANSFER IN A MICROCHANNEL FOR ELECTRONICS COOLING-Reference-Cited by-同舟云学术

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NUMERICAL SIMULATION OF FLOW AND CONJUGATE HEAT TRANSFER IN A MICROCHANNEL FOR ELECTRONICS COOLING

Published:1999-06 Issue:02 Volume:09 Page:141-153
ISSN:0960-3131
Container-title:Journal of Electronics Manufacturing
language:en
Short-container-title:Journal of Electronics Manufacturing

Author:

NG E. Y. K.,TSO C. P.,WEN Z. M.,CHOO K. F.

Publisher

World Scientific Pub Co Pte Lt

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://www.worldscientific.com/doi/pdf/10.1142/S0960313199000076

Reference13 articles.

1. High-performance heat sinking for VLSI

2. Microfluidics-a review

3. High flux boiling in low flow rate, low pressure drop mini-channel and micro-channel heat sinks

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Comprehensive study of synergistic effects of phase separation structures and electric fields for enhancing the heat transfer performance of minichannel heat sinks;Applied Thermal Engineering;2024-02

2. Heat transfer characteristics of two-phase flow in a double-layer microchannel heat sink;International Communications in Heat and Mass Transfer;2022-03

3. Process Intensification for Compact and Micro Heat Exchangers through Innovative Technologies: A Review;Industrial & Engineering Chemistry Research;2019-07-03

4. Review of micro- and mini-channel heat sinks and heat exchangers for single phase fluids;Renewable and Sustainable Energy Reviews;2015-01

5. Transient conjugate heat transfer in straight microchannels;International Journal of Heat and Mass Transfer;2012-12

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