Effect of thermal conductivity of substrate board for temperature control of electronic components: A numerical study

Abstract

The current study deals with the numerical investigation of the substrate board characteristics using different materials (FR4, silicon cladding and copper cladding) on which nine nonidentical electronic components (ECs) are mounted, which are supplied with nonuniform heat flux. The study is conducted for natural and forced convection (3[Formula: see text]m/s and 5[Formula: see text]m/s) modes of heat transfer. It is observed that for 5[Formula: see text]m/s the temperature of the ECs is dropped by 30–47∘C using copper cladding board in comparison to FR4 and silicon cladding board. It is also noted that with the use of copper cladding board the velocity of air required for cooling the ECs is substantially reduced by 2[Formula: see text]m/s and the temperature of the IC chip is reduced by 1.50–11.12∘C.