Three-dimensional uncertain heat equation

Author:

Ye Tingqing1,Yang Xiangfeng2

Affiliation:

1. Department of Mathematical Sciences, Tsinghua University, Beijing 100084, P. R. China

2. School of Information Technology and Management, University of International Business and Economics, Beijing 100029, P. R. China

Abstract

Heat equation is a partial differential equation describing the temperature change of an object with time. In the traditional heat equation, the strength of heat source is assumed to be certain. However, in practical application, the heat source is usually influenced by noise. To describe the noise, some researchers tried to employ a tool called Winner process. Unfortunately, it is unreasonable to apply Winner process in probability theory to modeling noise in heat equation because the change rate of temperature will tend to infinity. Thus, we employ Liu process in uncertainty theory to characterize the noise. By modeling the noise via Liu process, the one-dimensional uncertain heat equation was constructed. Since the real world is a three-dimensional space, the paper extends the one-dimensional uncertain heat equation to a three-dimensional uncertain heat equation. Later, the solution of the three-dimensional uncertain heat equation and the inverse uncertainty distribution of the solution are given. At last, a paradox of stochastic heat equation is introduced.

Funder

National Natural Science Foundation of China

Young Excellent Talents in UIBE

Publisher

World Scientific Pub Co Pte Lt

Subject

Computational Theory and Mathematics,Computer Science Applications,General Physics and Astronomy,Mathematical Physics,Statistical and Nonlinear Physics

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Partial derivatives of uncertain fields and uncertain partial differential equations;Fuzzy Optimization and Decision Making;2023-11-20

2. Applications of three-dimensional uncertain heat equations;Soft Computing;2023-02-22

3. Reliability analysis of the uncertain heat conduction model;Computers & Mathematics with Applications;2022-08

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