DIAMOND AND METAL BONDING BY ACTIVE SOLDER FOR MICRO – CUTTING WIRE

Abstract

A new method of bonding diamond to metal with active solder has been developed. This method was then used for making micro-cutting wire saws capable of cutting composite materials with high hardness. This cutting process is an environmentally friendly process, as diamond grains loss and hence pollution is minimum. The active solder contained titanium hydride ( TiH 2). Titanium hydride dissociates to atomic Ti and H at high temperatures improving wetting between the solder metal and diamond grains and hence high bonding strength can be obtained. An example of using the new wire for cutting a typical IC chip is given. We believe this environmentally friendly micro-cutting process will be widely used in the future.