Microstructure evolution and mechanical properties of copper/304 stainless-steel joints by low-temperature soldering
Author:
Affiliation:
1. Key Laboratory of Advanced Technologies of Materials, Ministry of Education, School of Materials Science and Engineering, Southwest Jiaotong University, Chengdu 610031, P. R. China
Abstract
Funder
Sichuan Science and Technology Program
National Natural Science Foundation of China
Publisher
World Scientific Pub Co Pte Ltd
Subject
Condensed Matter Physics,Statistical and Nonlinear Physics
Link
https://www.worldscientific.com/doi/pdf/10.1142/S021797922240015X
Reference12 articles.
1. Diffusion bonding of 410 stainless steel to copper using a nickel interlayer
2. Gas tungsten arc welding of CP-copper to 304 stainless steel using different filler materials
3. A combined full-field imaging and metallography approach to assess the local properties of gas tungsten arc welded copper–stainless steel joints
4. A study on induction welding of mild steel and copper with flux under applied load condition
5. Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering
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