Affiliation:
1. Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 106, Taiwan, ROC
2. Chemical Engineering Division, Institute of Nuclear Energy Research, Taoyuan 32546, Taiwan, ROC
3. Department of Biomedical Engineering, University of Texas, Dallas, Richardson, Texas, USA
Abstract
The dissolution behavior of the Ni substrate and Ni3Sn4 phase was studied in the following molten lead-free solders: Sn, (wt.%) Sn–3.0Ag–0.5Cu (SAC), Sn–0.7Cu (SC), Sn–58Bi (SB) and Sn–9Zn (SZ) at 240[Formula: see text]C, 270[Formula: see text]C and 300[Formula: see text]C. The dissolution rate of the Ni substrate in solder decreased from Sn, SAC, SC, SB, to SZ. The thick Ni5(Zn, Sn)[Formula: see text] phase formed at the SZ/Ni interface hindering the Ni dissolution. Ni3Sn4 phase dissolution rate in molten solder decreased from Sn, SZ, SAC, SC, to SB at 240[Formula: see text]C and SC, Sn, SAC, SZ, to SB at 300[Formula: see text]C. The (Cu, Ni)6Sn5 phase spilling was observed at the SAC/Ni3Sn4 and SC/Ni3Sn4 interfaces. Zn in the SZ solder reacted with the Ni3Sn4 phase to form the (Ni, Sn)5Zn[Formula: see text] phase at the interface.
Publisher
World Scientific Pub Co Pte Lt
Subject
Condensed Matter Physics,Statistical and Nonlinear Physics
Cited by
1 articles.
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