An ANN Model to Estimate the Impact of Tea Process Parameters on Tea Quality

Author:

Saikia Debashis1,Sarma Diganta Kumar2,Boruah P. K.1,Sarma Utpal1

Affiliation:

1. Department of Instrumentation and USIC, Gauhati University, Guwahati, Assam 781014, India

2. Department of Physics, B.Borooah College, Guwahati, Assam-781007, India

Abstract

Present study deals with the development of an artificial neural network (ANN)-based technique for tea quality quantification by monitoring fermentation and drying condition of the tea processing stages. An RS485 network-based instrumentation system has been developed and implemented for data collection for these two stages. Three calibrated sensor nodes are installed in the fermentation room due to its larger floor area to collect temperature and relative humidity (RH). Dryer inlet temperature is recorded using a calibrated thermocouple-based sensor node. From seven input parameters and target quality data obtained from tea taster, the ANN model has been developed to find the correlation between the process condition and the tea quality. From the correlation study, more than 90% classification rate is obtained from the model. The model is also validated with some independent data showing more than 60% correlation. Error in terms of root mean square error (RMSE) is about 0.17. This model will be helpful for improvement of tea quality.

Publisher

World Scientific Pub Co Pte Lt

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Electrical and Electronic Engineering,Hardware and Architecture

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Investigation on the Effect of Process Conditions during Fermentation of Tea Manufacturing on Brightness of Tea Liquor;2023 1st International Conference on Circuits, Power and Intelligent Systems (CCPIS);2023-09-01

2. Implementation of Machine Learning Techniques to Predict Briskness and Brightness of Tea Liquor using Factory Data;2021 International Conference on Disruptive Technologies for Multi-Disciplinary Research and Applications (CENTCON);2021-11-19

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