Enabling Packaging Integration of Paper-based Electrical Gas Sensors for the Monitoring of Spoilage in Fresh Spinach

Author:

Naik Atharv,Lee Hong Seok,Herrington JackORCID,Barandun Giandrin,Flock Genevieve,Güder FiratORCID,Gonzalez-Macia LauraORCID

Abstract

AbstractGas sensors present an alternative to traditional off-package food quality assessment, due to their high sensitivity and fast response without the need of sample pre-treatment. The safe integration of gas sensors into packaging without compromising sensitivity, response rate, and stability, however, remains a challenge. Such packaging integration of spoilage sensors is crucial towards preventing food waste and transitioning towards more sustainable supply chains. Here, we demonstrate a wide-ranging solution to enable the use of gas sensors for the continuous monitoring of food spoilage, building upon our previous work on Paper-based Electrical Gas Sensors (PEGS). By comparing various materials commonly used in the food industry, we analyze the optimal membrane to encapsulate PEGS for packaging integration. Focusing on spinach as a high-value crop, we assess the feasibility of PEGS to monitor the gases released during its spoilage at low and room temperatures. Finally, we integrate the sensors with wireless communication and batteryless electronics, creating a user-friendly system to evaluate the spoilage of spinach, operated by a smartphone via Near Field Communication (NFC). The work reported here provides an alternative approach that surpasses traditional on-site and in-line monitoring, ensuring comprehensive monitoring of food shelf life.

Publisher

Cold Spring Harbor Laboratory

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