Innovative Epoxy Resin Formulation

Abstract

Polymer resin systems have many advantages over conventional cement. Since resins are solids free, they can be used in low injectivity zones such as narrow fractures where conventional cement cannot be pumped. In order to ensure successful field applications of resin systems, downhole temperature must be checked. The objective of this paper is to introduce a high temprarure resin system compared to conventional ones, evaluate the stability of epoxy resin formulation at high temperatures and identify the optimum temperature for successful application. Despite the many advantages of polymer resins, they have few limitations that can affect their performance and the success. One important limitation of resins is temperature sensitivity. Temperature affects the speed of the reaction of the resin with the curing agent. Therefore, it is important to design the polymer resin according to downhole conditions. As curing temperature approach glass transition temperature, the mechanical properties of the cured resin are compromised. Resin formulation #1 investigated in this study was used in the field for different applications. However, all the application were performed in tempratures lower than 225 °F due to temperature limitation. The objective of this paper is to investigate new resin formulation and its suitability to be applied in deeper section where temperature is way above 225 °F reaching in some application to more than 290 °F. The resin formulation was cured through polymerization process using an amine curing agent to improve properties even further. The final cured polymer was then analyzed through DSC, TGA, and SEM experiments.