Electro-mechanically controlled assembly of reconfigurable 3D mesostructures and electronic devices based on dielectric elastomer platforms

Author:

Pang Wenbo12ORCID,Cheng Xu12,Zhao Haojie3,Guo Xiaogang12,Ji Ziyao12,Li Guorui4,Liang Yiming4,Xue Zhaoguo12ORCID,Song Honglie12,Zhang Fan12,Xu Zheng125,Sang Lei3,Huang Wen3,Li Tiefeng6,Zhang Yihui12ORCID

Affiliation:

1. Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China

2. Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China

3. School of Microelectronics, Soft Membrane Electronic Technology Laboratory, Hefei University of Technology, Hefei 230601, China

4. Zhejiang Lab, Hangzhou 311100, China

5. State Key Laboratory for Manufacturing and Systems Engineering, School of Mechanical Engineering, Xi'an Jiaotong University, Xi'an 710049, China

6. Center for X-Mechanics, Zhejiang University, Hangzhou 310027, China

Abstract

Abstract The manufacture of 3D mesostructures is receiving rapidly increasing attention, because of the fundamental significance and practical applications across wide-ranging areas. The recently developed approach of buckling-guided assembly allows deterministic formation of complex 3D mesostructures in a broad set of functional materials, with feature sizes spanning nanoscale to centimeter-scale. Previous studies mostly exploited mechanically controlled assembly platforms using elastomer substrates, which limits the capabilities to achieve on-demand local assembly, and to reshape assembled mesostructures into distinct 3D configurations. This work introduces a set of design concepts and assembly strategies to utilize dielectric elastomer actuators as powerful platforms for the electro-mechanically controlled 3D assembly. Capabilities of sequential, local loading with desired strain distributions allow access to precisely tailored 3D mesostructures that can be reshaped into distinct geometries, as demonstrated by experimental and theoretical studies of ∼30 examples. A reconfigurable inductive–capacitive radio-frequency circuit consisting of morphable 3D capacitors serves as an application example.

Funder

National Natural Science Foundation of China

Tsinghua University Initiative Scientific Research Program

Tsinghua National Laboratory for Information Science and Technology

Hefei University of Technology

National Key R&D Program

Publisher

Oxford University Press (OUP)

Subject

Multidisciplinary

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