Dielectric breakdown sizes of conducting plates

Author:

Yang Mimi X1,Yang Fuqian2,Lee Sanboh3

Affiliation:

1. Stanford University, Department of Electrical Engineering, Stanford, CA 94305-9505, USA

2. University of Kentucky, Materials Program, Department of Chemical and Materials Engineering, Lexington, KY 40506, USA

3. National Tsing Hua University, Department of Materials Science and Engineering, Hsinchu 300, Taiwan

Abstract

Abstract In this work, we propose mathematical formulations that detail the effect of the dielectric strength of dielectric material on the spatial distribution of electric field in an infinite space with a conducting plate. Using the dielectric strength of air as the maximum limit for the magnitude of electric field intensity and the equivalence of stored charge between two different zones, we determine the size of the dielectric breakdown region (the extended region with ionized material) for the conducting strip and the conducting disk charged to an electric voltage. The size of dielectric breakdown is proportional to the square of the applied voltage, and decreases with the increase of the width/radius of the conducting strip/disk.

Publisher

Oxford University Press (OUP)

Subject

Applied Mathematics

Reference21 articles.

1. Recent advances in gaseous dielectrics at oak ridge National Laboratory;Christophorou;IEEE Transactions on Electrical Insulation,1984

2. Soft breakdown of ultra-thin gate oxide layers;Depas;IEEE Transactions on Electron Devices,1996

3. Dielectric breakdown process of polymers;Ieda;IEEE Transactions on Electrical Insulation,1980

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