The biomechanics of seed germination
Author:
Funder
Biotechnology and Biological Sciences Research Council
Publisher
Oxford University Press (OUP)
Subject
Plant Science,Physiology
Link
http://academic.oup.com/jxb/article-pdf/68/4/765/10766969/erw428.pdf
Reference194 articles.
1. Skeleton of Euplectella sp.: Structural Hierarchy from the Nanoscale to the Macroscale
2. The effects of moisture content, compression speeds, and axes on mechanical properties of walnut cultivars;Altuntas;Food and Bioprocess Technology,2011
3. Physical and mechanical properties of some walnut (Juglans regia L.) cultivars;Altuntas;International Journal of Food Engineering,2008
4. Effect of moisture content on some physical and mechanical properties of faba bean (Vicia faba L.) grains;Altuntas;Journal of Food Engineering,2007
5. Solute permeation across the apoplastic barrier in the perisperm–endosperm envelope in cucumber seeds;Amritphale;Planta,2010
Cited by 160 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Recent Advances in Non-Thermal Plasma for Seed Germination, Plant Growth, and Secondary Metabolite Synthesis: A Promising Frontier for Sustainable Agriculture;Plasma Chemistry and Plasma Processing;2024-09-14
2. The phosphatidylethanolamine-binding proteins OsMFT1 and OsMFT2 regulate seed dormancy in rice;The Plant Cell;2024-07-23
3. Rupture Test: A New Method for Evaluating Maize (Zea mays) Seed Vigour;Plants;2024-07-04
4. Functional mechanism study of the allelochemical myrigalone A identifies a group of ultrapotent inhibitors of ethylene biosynthesis in plants;Plant Communications;2024-06
5. Physical Seed Dormancy in Legumes: Molecular Advances and Perspectives;Plants;2024-05-27
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3