Coupling between Vias and the PCB Power-Bus-Reference-Cited by-同舟云学术

Coupling between Vias and the PCB Power-Bus

Published:2009-05-19 Issue: Volume:7 Page:261-265
ISSN:1684-9973
Container-title:Advances in Radio Science
language:en
Short-container-title:Adv. Radio Sci.

Author:

Heinrich G.,Dickmann S.

Abstract

Abstract. In this paper, a method for the extraction of data for a through-hole vertical interconnect access (via) on a printed circuit board (PCB) is presented. It uses a matrix de-embedding algorithm and two-port theory to extract the elements of an assumed lumped via model. After that the influence of the via on the power-bus impedance and the coupling between the via and the power-bus are described using this model.

Publisher

Copernicus GmbH

Link

https://ars.copernicus.org/articles/7/261/2009/ars-7-261-2009.pdf

Reference11 articles.

1. Hampe, M. and Dickmann, S.: Damping of Cavity-Mode Resonances in PCB Power-Bus Structures Using Discrete Capacitors, IEEE T. Electromagn. C., 47, 880–880, 2005.

2. Hampe, M. and Dickmann, S.: Single Summation Expression for the Impedance of Rectangular PCB Power-Bus Structures Loaded With Multiple Lumped Elements, IEEE T. Electromagn. C., 49, 58–67, 2007.

3. Heinrich, G. and Dickmann, S.: On the Influence of Vias on the PCB Power-Bus, Proceedings of the International Symposium on EMC (EMC Europe 2008), Hamburg, 85–90, 2008

4. Lei, G.-T., Techentin, R. W., and Gilbert, B. K.: High-Frequency Characterization of Power/Ground-Plane Structures, IEEE Transactions on Microwave Theory and Techniques, 47, 562–569, 1999.

5. Antonini, G., Scogna, A. C., and Orlandi, A.: Equivalent Network Synthesis for Via Holes Discontinuities, IEEE Transactions on Advanced Packaging, 25, 528–536, 2002.

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