Abstract
Abstract. Power semiconductors are used in a growing number of applications.
Furthermore, faster switching transients and therefore higher switching
frequencies can be realised. This leads to higher radiated interferences at
higher frequencies. In power electronic applications, often a cooling concept
for the semiconductors is required to comply with the allowed temperature
range. Typically, heat sinks are made of aluminium and their conductive
behaviour can cause EMC problems. Via capacitive coupling, voltage transients
are transferred from the power semiconductor to the heat sink, so that the
heat sink behaves as an antenna and radiated interferences occur.
Furthermore, a common mode current will appear if the heat sink is grounded.
In this paper, a promising approach to reduce radiated interferences from the
heat sink and solve the common mode issue by using an electrically isolating
ceramic heat sink is presented. The influence of an aluminium nitride ceramic
heat sink on cooling performance and EMC behaviour has been investigated. For
this purpose, two geometrical identically heat sinks made from aluminium and
aluminium nitride have been compared regarding thermal performance and
radiated interferences characterised by S-parameters.
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