Simulation Study on Low Thermal Resistance Materials to Improve Pipe-laying Cable Ampacity

Author:

Wang Yanfeng,Zhu Wenwei,Guo Yaodong,Xu Zhifeng,Wu Zhaojian,Li Rongjun,Liu Gang

Abstract

Pipe-laying cables have been widely used in the urban power transmission grid. The ampacity of the pipe-laying cables is affected by the thermal conductivity of the filling material, the ratio of the filling material and other factors. For this part of the content, the existing research is not enough. In this paper, a multi-field coupling model for pipe-laying cables is established and the validity of the proposed model is verified by the cable experiment. Based on the proposed multi-field model, three different filling materials have been compared and several influence factors have been investigated. Results show that the filling materials can significantly improve the heat dissipation environment in the pipe and increase the ampacity of the cable. Different filling materials, as well as their filling proportion in the pipe, will ultimately affect the ampacity of the cable. The results can provide guidance in practical engineering application.

Publisher

EDP Sciences

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3