Author:
Zhou Hongxia,Fransson Åke,Olofsson Thomas
Abstract
To understand the influence of PCM wall configurations on the thermal performance of building envelopes, an explicit finite element model of heat transfer from indoor to outdoor (or vice versa) is developed. The accuracy of this model is first validated against the electrical circuit analogy model, and then compared with the experimental data measured in a Hot-Box device. A good agreement between the simulation results and experimental results is obtained. The results of this study show that the PCM configuration layer sequence significantly will affect the thermal performance of building envelopes and that the FEM model developed is a promising tool, which after some more development may be used for optimising PCM wall configurations.
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献