Author:
Li Jinyuan,Cui Meiting,Du Yujie,Ke Junji,Zhao Zhibin
Abstract
Compared to the silicon power devices, silicon carbide device has shorter switch time. Hence, as a result of the faster transition of voltage (dv/dt) and current (di/dt) in SiC MOSFET, the influence of parasitic parameters on SiC MOSFET’s switching transient is more serious. This paper gives an experimental study of the influence of parasitic inductance on SiC MOSFET’s switching characteristics. Most significance parameters are the parasitic inductances of gate driver loop and power switching loop. These include the SiC MOSFET package’s parasitic inductance, interconnect inductance and the parasitic inductance of dc link PCB trace. This paper therefore focuses on analysis and comparison of different parasitic parameters under various operation conditions in terms of their effect on overvoltage, overcurrent and switching power loss.
Reference13 articles.
1. Kimoto T, Cooper J A. Fundamentals of silicon carbide technology [J]. 2014.
2. Baliga B. J., Fundamentals of Power Semiconductor Devices. New York: Springer, 2008.
3. Lee J S, Chun D H, Park J H, et al. Design of a novel SiC MOSFET structure for EV inverter efficiency improvement[C]//IEEE, International Symposium on Power Semiconductor Devices & Ic’s. 2014: 281-284.
4. Miao Z, Mao Y, Ngo K, et al. Package influence on the simulated performance of 1.2 kV SiC modules[C]// Wide Bandgap Power Devices and Applications. IEEE, 2015.
5. Xu Y, Li H, Zheng T Q, et al. Study on the Pspice Simulation Model of SiC MOSFET base on its Datasheet[C]// Ifeec. 2015.
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