Semi-analytical transient solutions of fully thermomechanical coupled problem for sliding contact

Abstract

The semi-analytical transient solutions of fully thermomechanical coupling for sliding contact have been deduced by using the plane-point heat source equivalent method, the thermoelastic displacement potential and the central difference method. To improve the calculated efficiency, the discrete convolution and fast Fourier transform are applied. The effects of coupled term, sliding velocity, frictional coefficient and initial temperature on temperature rise and the influence of thermal behavior on stress are studied. Results indicate that the coupled term can significantly affect the temperature rise for high velocity and it can be ignored for low velocity; the temperature rise is sensitive to the sliding velocity and the frictional coefficient; the Mises stress on the contact patch is decreased when considering thermal effect.