Growth kinetics, polymerization and protection of Cu-X-BTA filmsss-Reference-Cited by-同舟云学术

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Growth kinetics, polymerization and protection of Cu-X-BTA filmsss

Published:1993-12 Issue:12 Volume:90 Page:1631-1636
ISSN:0035-1563
Container-title:Revue de Métallurgie
language:
Short-container-title:Rev. Met. Paris

Author:

Brusic V.,Frisch M.A.,Eldridge B.N.,Kaufman F.B.,Petersen T.A.,Schrott A.,Frankel G.S.

Publisher

EDP Sciences

Subject

Materials Chemistry,Metals and Alloys,Physical and Theoretical Chemistry,Condensed Matter Physics

Link

http://www.metallurgical-research.org/10.1051/metal/199390121631/pdf

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Relationship Between Molecular Structure and Removal Rates during Chemical Mechanical Planarization: Comparison of Benzotriazole and 1,2,4-Triazole;Journal of The Electrochemical Society;2008

2. Atomic force microscopic study of polymeric film growth in copper electroplating bath with benzotriazole;Journal of Electroanalytical Chemistry;2007-03

3. Anion Effects on Cu–benzotriazole Film Formation;Journal of The Electrochemical Society;2007

4. Infrared Studies of Benzotriazole on Copper Electrode Surfaces: Role of Chloride in Promoting Reversibility;Journal of The Electrochemical Society;2001

5. Benzotriazole as an Additive for Copper Electrodeposition Influence of Triazole Ring Substitution;Journal of The Electrochemical Society;2000

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