From photon emission microscopy to Raman spectroscopy: Failure analysis in microelectronics-Reference-Cited by-同舟云学术

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From photon emission microscopy to Raman spectroscopy: Failure analysis in microelectronics

Published:2004-07 Issue:1-3 Volume:27 Page:59-65
ISSN:1286-0042
Container-title:The European Physical Journal Applied Physics
language:
Short-container-title:Eur. Phys. J. Appl. Phys.

Author:

De Wolf I.,Rasras M.

Publisher

EDP Sciences

Subject

Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Link

http://www.epjap.org/10.1051/epjap:2004073/pdf

Reference14 articles.

1. Photon Emission from Avalanche Breakdown in Silicon

2. N. Khurana, inProceedings of the Int. Reliability Physics Symp. 1984, p. 122

3. N. Khurana, T. Maloney, W. Yeh. inProceeding of IEEE/IRPS 1985, p. 212

4. Quantitative emission microscopy

5. M. Cardona, inProceedings SPIE 822, 1987, p. 2

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Coupling between the Raman Spectroscopy and Photoemission Microscopy Techniques: Investigation of Defects in Biased 4H-SiC pin Diodes;Materials Science Forum;2007-09

2. Two-dimensional surface characterization of laser-deposited carbon films using Raman scattering;Laser-based Micropackaging;2006-02-09

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