1. Steinberg D., ”Vibration Analysis for Electronic Equipment”, 2-nd ed., John Wiley, 1988.
2. JEDEC Standard JESD22-B104-B, Mechanical Shock, 2001
3. JEDEC Standard JESD22-B111, Board Level Drop Test Method of Components for Handheld Electronic Products, 2003
4. Suhir E., “Dynamic Response of Micro-Electronic Systems to Shocks and Vibrations: Review and Extension”, in E. Suhir, CP Wong, YC Lee, eds. “Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability”, Springer, 2007
5. Suhir E., Steinberg D., Yi T., “Dynamic Response of Electronic and Photonic Systems to Shocks and Vibrations”, John Wiley, 2011