Bio-based materials from sunflower co-products, a way to generate economical value with low environmental footprint

Author:

Evon PhilippeORCID,Jégat Landry,Labonne Laurent,Véronèse Thierry,Ballas Stéphane,Tricoulet Lucas,Li Jing,Geelen Danny

Abstract

Sunflower co-products (i.e., stalks and heads) were recently used to create a value chain of sunflower biomass. On the one hand, bioactive ingredients extracted through twin-screw extrusion can be valorized as ecologically friendly agricultural products. On the other hand, in this study, the remaining solid, i.e., the extrudate, was used for obtaining bio-based materials, generating economical value with low environmental footprint. It is processable into cohesive boards through hot pressing. According to NF EN 312, optimal board (37 MPa flexural strength, and 33% thickness swelling) containing 9.1% (w/w) sunflower proteins as binder can be used as a type P2 board, i.e., for interior fittings (including furniture) in dry environments. For P3 and P4 types, a thickness swelling lower than 20% and 21%, respectively, will be required. The extrudate can be also separated into long fibers and fines. Long fibers can be compression molded into low-density insulation blocks (49 mW/m K thermal conductivity). Fines can be used as a filler for reinforcing (bio)plastics, e.g., polypropylene and poly (lactic acid). These bio composites could be injected into pots or tutors for plants, or even extruded into window openings or exterior decking.

Funder

Agence Nationale de la Recherche

Flanders Innovation and Entrepreneurship

Publisher

EDP Sciences

Subject

Agronomy and Crop Science,Biochemistry,Food Science

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3