Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process
Author:
Publisher
EDP Sciences
Subject
General Medicine
Link
http://www.matec-conferences.org/10.1051/matecconf/20179701059/pdf
Reference10 articles.
1. Investigation of the fluid/structure interaction phenomenon in IC packaging
2. Study on the fluid/structure interaction at different inlet pressures in molded packaging
3. Fluid/Structure Interaction Analysis of the Effects of Solder Bump Shapes and Input/Output Counts on Moulded Packaging
4. CFD modeling of pin shape effects on capillary flow during wave soldering
5. Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey‐based Taguchi method
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