Wettability study of lead free solder paste and its effect towards multiple reflow-Reference-Cited by-同舟云学术

Wettability study of lead free solder paste and its effect towards multiple reflow

Published:2016 Issue: Volume:74 Page:00038
ISSN:2261-236X
Container-title:MATEC Web of Conferences
language:
Short-container-title:MATEC Web Conf.

Author:

Idris Siti Rabiatull Aisha,Zuleikha Siti,Abd Malek Zetty Akhtar

Publisher

EDP Sciences

Subject

General Medicine

Link

http://www.matec-conferences.org/10.1051/matecconf/20167400038/pdf

Reference13 articles.

1. Dongxia X., Xusheng L., Caiqin W., and Bin X..Study on wettability and corrosivity of a new no-clean flux for lead-free solder paste in electronic packaging technology. inMechanic Automation and Control Engineering (MACE), 2011 Second International Conference on. (2011)

2. Vijay K..Miniaturization — Solder paste attributes for maximizing the print & reflow manufacturing process window. inElectronic System-Integration Technology Conference (ESTC), 2012 4th. (2012)

3. Lathrop R..Solder paste printing and stencil design considerations for wafer bumping. inElectronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International. (2004)

4. Plotog I., Svasta P., Cucu T., Vasile A., and Marin A..Solder paste shelf life extending approach for prototyping and small series activities. inElectronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar on. (2009)

5. Schmitt W..Resin / Rosin Free Solder Pastes and Fluxes. inElectronics Systemintegration Technology Conference, 2006. 1st. (2006)

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