Concept and Technology for Full Monolithic MOSFET and JBS Vertical Integration in Multi-Terminal 4H-SiC Power Converters

Author:

Makhoul Ralph1,Beydoun Nour2,Bourennane Abdelhakim1,Phung Luong Viet3ORCID,Richardeau Frédéric4,Lazar Mihai2,Godignon Philippe5,Planson Dominique3ORCID,Morel Hervé3,Bourrier David1

Affiliation:

1. University of Toulouse, CNRS, UPS

2. University of Technology of Troyes

3. Univ Lyon, INSA Lyon, CNRS UMR5005

4. University of Toulouse, CNRS, INPT, UPS

5. IMB-CNM

Abstract

New and original medium power multi-terminal SiC monolithic converter architectures are investigated with vertical switching cells based on SiC JBS diodes and VDMOS transistors. 2D TCAD and mixed-mode Sentaurus™ simulations are performed to optimize switching structures as Buck, Boost, H-bridge high-side row chip common drain-type and low-side row chip common source-type. The proper operation in the turn-on and turn-off of each cell is also studied and validated. To fabricate these new monolithic integrated architectures, two main technological bricks have been developed, for vertical insulation and the integration of a top Ni metal via. To achieve the vertical insulation deep trenches are necessary combining dry plasma and wet KOH electrochemical etching through the thick N+ substrate.

Publisher

Trans Tech Publications, Ltd.

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