Near-Interface Defect Decomposition during NO Annealing Analyzed by Molecular Dynamics Simulations

Author:

Ohuchi Yuki1,Saeki Hidenori1,Sakakima Hiroki2,Izumi Satoshi2

Affiliation:

1. Fuji Electric Co., Ltd.

2. The University of Tokyo

Abstract

We have used molecular dynamics simulations to investigate the decomposition mechanisms of residual C defects near the interface of 4H-SiC/SiO2 during NO annealing. We have observed drastically rapid defect decomposition by NO and O2 mixed gas, which is thermodynamically more realistic, compared with single NO or O2 gas annealing. We have constructed simplified defect decomposition model. This model numerically reproduced the simulation results, suggesting that multi-step and cooperative reactions caused by the coexistence of NO and O2 during NO annealing effectively promote the decomposition of residual C defects.

Publisher

Trans Tech Publications, Ltd.

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