Effect of High Temperature and Humidity on Bond Strength of Al/Resin Adhesive Joints

Abstract

The adhesive strength and degradation behavior of the Al/resin interface was investigated under high temperature and high humidity conditions. The adhesive strength of the joint without aging was approximately 14 MPa. The value is the same as the Cu/resin joint. With progress of aging at 85°C in 85%R. H., the strength decreased rapidly in the early aging stage and decreased gradually by further aging. The strength of the Al/resin joint was inferior to that of the Cu/resin joint after aging. The fracture mainly occurred in the interface of the joint. The result of Fourier transform infrared spectroscopy analysis for the fracture surface showed that water absorption in the Al/resin joint occurs by aging and causes the degradation of the strength.