Affiliation:
1. Soitec S.A.
2. Thermap Solutions Ltd.
3. NOVASiC
Abstract
A review of the specific characterisation techniques developed and customized for SmartSiC™ substrates is given. A focus is made on thermal characterization of this engineered structure as well as its beneficial features with regards to bipolar degradation.
Publisher
Trans Tech Publications, Ltd.
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Cited by
1 articles.
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