Affiliation:
1. Xi’an University of Science and Technology
Abstract
The heat dissipation of electronic components is of great importance to the development of microelectronics industry. Polymer matrix composites have become a research hotspot due to their advantages in molding, insulation and cost. In this paper, the mechanism and influencing factors of thermal conductivity of polymer matrix composites are introduced, the research status of thermal network formation is reviewed, and the development trend of thermal conductivity composites is forecasted.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
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