Abstract
Wafer scratching from handling and processing can impact the performance of devices grown on a substrate. Knowledge of process conditions and modeling of scratches on wafers can be used to elucidate the root cause of scratches so that they can be eliminated.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference5 articles.
1. C.L. Neslen, W.C. Mitchel, and R.L. Hengehold, J. Electronic Materials, 30(10), 1271-1275, (2001).
2. E.K. Sanchez, S. Ha, J. Grim, M. Skowronski, W.M. Vetter, M. Dudley, R. Bertke, and W.C. Mitchel, J. Of the Electrochemical Society, 149(2), G131-G136, (2002).
3. Chi-Young Choi, Joon-Hyung Lee, and Sang-Hee Cho, Solid-State Electronics, 43, 2011-2020, (1999).
4. C. Martin, T.M. Kerr, W. Stepko, T. Anderson, CS Mantech, (2004).
5. T-Y Kwon, M. Ramachandran, and J-G Park, Friction, 1(4), 281-305, (2013).
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献