Affiliation:
1. University of the Philippines
Abstract
Recently, copper (Cu) and silver (Ag) nanowires have been widely employed as conductive fillers in flexible electronic devices due to their high aspect ratios leading to the formation of conductive networks in a polymeric substrate. This study combined Cu and Ag as a 1-dimensional nanostructures through galvanic replacement with a core-shell configuration. The effects of the galvanic replacement factors on the Cu-Ag core-shell nanostructures morphology was studied by varying the reaction time, temperature, and Ag concentration. SEM images show a more extensive Cu dealloying and Kirkendall voiding with longer reaction times, resulting in the Cu core dissolution. Homogenous nucleation of Ag occurs at higher reaction temperatures and Ag concentrations, producing separate Ag particles.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science