The Higher Order Crack Tip Fields for Anti-Plane Crack in Functionally Graded Piezoelectric Materials

Author:

Dai Yao1,Chong Xiao1,Li Shi Min2

Affiliation:

1. Armored Force Engineering College

2. Academy of Armored Force Engineering

Abstract

The anti-plane crack problem is studied in functionally graded piezoelectric materials (FGPMs). The material properties of the FGPMs are assumed to be the exponential function of y. The crack is electrically impermeable and loaded by anti-plane shear tractions and in-plane electric displacements. Similar to the Williams solution of homogeneous material, the high order asymptotic fields are obtained by the method of asymptotic expansion. This investigation possesses fundamental significance as Williams solution.

Publisher

Trans Tech Publications, Ltd.

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