Reliability Failure Analysis of PCB and its Technological Improvement-Reference-Cited by-同舟云学术

Reliability Failure Analysis of PCB and its Technological Improvement

Published:2013-09 Issue: Volume:401-403 Page:391-394
ISSN:1662-7482
Container-title:Applied Mechanics and Materials
language:
Short-container-title:AMM

Author:

Zhu Li Fang¹

Affiliation:

1. China Electronics Technology Group Corporation

Abstract

Reliability failure analysis is extremely important in the manufacturing process of PCB (Printed Circuit Board). In this paper, we use thermal shock test method to analysis the electrical interconnection reliability of PCB in harsh environment. Also taking into account the reliability of PCB is closely related to its design and technology, approaches of technological improvement are proposed. Finally through temperature shock test method, the results show that the reliability of PCB designed with improved technology is enhanced.

Publisher

Trans Tech Publications, Ltd.

Link

https://www.scientific.net/AMM.401-403.391.pdf

Reference5 articles.

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3. Sun Jian-liang, Zhao Bao-ping. Numerical Simulation of Temperature Shock Test for Materiel, Equipment Environmental Engineering, 1(2006)42-46.

4. Li Xiao-ming, Zhai Yu-huan, Pu Hong-kun. Reliability Test and Evaluation for Printed Circuit Board , Printed Circuit Information, 7(2010)76-80.

5. Yang Hai-yong, Sun Jian. Analysis and Improvement of Multi-Layer PCB Plated Slot Hole Wall Pull Away, Printed Circuit Information, S1(2010)110-115.

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