Improvement of Adhesion of Cubic Boron Nitride Films: Effect of Interlayer and Deposition Parameters
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Published:2005-01
Issue:
Volume:475-479
Page:3635-3640
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ISSN:1662-9752
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Container-title:Materials Science Forum
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language:
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Short-container-title:MSF
Author:
He Qi1,
Li Cheng Ming1,
Lu Fan Xiu1,
Pilione Lawrence,
Messier Russell F.
Affiliation:
1. University of Science and Technology Beijing
Abstract
Diamond and B4C coatings were used as an interlayer for the growth of cubic boron
nitride thin films on c-silicon. By employing a B-C-N gradient layer on top of the B4C interlayer, improved adhesion occured between BN and B4C. A multi-step process after the nucleation of c-BN was found very helpful for improving the adhesion of c-BN on silicon with interlayers. Residual stress of c-BN thin film was significantly decreased by using a new post-deposition annealing treatment.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science