Affiliation:
1. FAMU-FSU College of Engineering and National High Magnetic Field Laboratory
2. FAMU-FSU College of Engineering
Abstract
Deformation and recrystallization texture has been investigated in Oxygen free high conducting (OFHC) copper wires drawn at room temperature to true strain of 2.31, and isothermally annealed at various temperatures between 150°C and 750°C. Local orientations of the microstructures were measured by means of electron backscattered diffraction (EBSD) technique. While the drawn wire was characterized by a major<111> + minor<100> duplex fiber texture, recrystallization occurred at annealing temperatures between 250°C and 400°C and resulted into a major<100>+minor<111> recrystallization texture. At temperatures above 500°C, the <100> dominated recrystallization texture changed to the <111> dominated growth texture due to secondary recrystallization, which favored the <111> orientation at the expense of the <100> component.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference13 articles.
1. Dj Schneider-Muntau, H. -J., Physica, Vol. B211 (1995), p.38.
2. C.A. Swenson, W.S. Marshall, A.V. Gavrilin, K. Han, J. Schillig, J.R. Sims Jr., and H.J. Schneider-Muntau, Physica B, Vol. 346-347 (2004), p.561.
3. F. Dupouy, S. Askenazy, J. P. Peyrade, and D. Legat, Physica B, Vol. 211 (1995), p.43.
4. D. R. Waryoba and P. N. Kalu, Microscopy and Microanalysis, Vol. 9 (2003), p.84.
5. C. J. McHargue, L. K. Jetter, and J. C. Ogle, Trans. Met. Soc. AIME, Vol. 215 (1959), p.831.
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献