Research on the Coupling between Electromagnetic Pressure and Temperature Field in Dual-Frequency Electromagnetic Shaping Process
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Published:2003-08
Issue:
Volume:426-432
Page:3855-3860
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ISSN:1662-9752
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Container-title:Materials Science Forum
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language:
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Short-container-title:MSF
Author:
Shen Jun1,
Pei Xinfeng,
Lu Bai Ping2,
Li Shuang Ming1,
Liu Lin1,
Fu Heng Zhi1
Affiliation:
1. Northwestern Polytechnical University
2. Nanchang Hangkong University
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science