Mathematical Model of Powder Material Particles Heating in Thermal Spraying

Author:

Bogdanovich Valery I.1,Giorbelidze Mikhail G.1

Affiliation:

1. Samara National Research University

Abstract

This paper discusses the mathematical model of powder material particles heating in the gas flow when applying plasma gas and thermal coatings. It has been assumed that while moving in the plasma, the particle is heated by convective heat transfer and radiative heat transfer. To ensure accuracy and validity of calculation, two characteristic regions have been outlined: Core, where the temperature, density, and viscosity of plasma, as well as the other parameters are assumed as constant; and the region from the core to the coated surface (substrate), where these parameters are the functions of the plasma flow coordinates. One of the assumptions is that the shape of the particles is near-spherical, and the thermal flow’s action to the particles’ surface is uniform. Special attention has been paid to correct selection of criteria , which allowed to simplify the solution and reduce it to the ordinary first-order differential equation derived from the particle heat balance equation.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference13 articles.

1. Barvinok V.A. Plasma and technologies, reliability, resource, Moscow, Nauka i Tekhnologii Publishers, (2005).

2. Bobrov G.V., Ilin A.A., Spektor V.S. Theory and technology of inorganic coatings formation, Moscow, Alfa-M Publishers, (2014).

3. Puzryakov A.F. Theoretical bases of plasma spraying technology, Moscow, Bauman Moscow State Technical University Publishers, (2003).

4. Ilyushchenko A.F., Shevtsov A.I., Okovity V.A. The processes and modeling of thermal spray coatings formation, Minsk, Belarus nauka, (2011).

5. Barvinok V.A., Bogdanovich V.I., Dokukina I.A. Mathematical modeling and physics of applying the plasma coating of composite clad powders processes, Moscow, International center NTI, (1998).

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