Analysis of Solder Fatigue in Electronic Packaging Using a Mesh-Insensitive Structural Stress Method
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Published:2008-06
Issue:
Volume:580-582
Page:233-238
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ISSN:1662-9752
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Container-title:Materials Science Forum
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language:
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Short-container-title:MSF
Author:
Hong Jeong K.1,
Dong Ping Sha1
Abstract
Solder fatigue is one of the major product reliability concerns in electric packaging
design. In this paper, the application of a mesh-insensitive structural stress method, previously
developed by the authors, is demonstrated for characterizing fatigue of solder joints under thermal
fatigue and mechanical fatigue conditions. Three sets of experimental data from literature are
analyzed to demonstrate the effectiveness of the structural stress method in its ability to correlate
test data over different packaging designs, test methods, etc. As evidenced in this study, the meshinsensitive
structural stress method offers a simple but effective means to correlate the fatigue
behavior of solder joints among various test conditions. The results show that the structural stress
method can be used as an effective alternative to existing methods in the literature, in reliability
design of electronic packaging.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science