Coalescence Characteristics of Fusible Particles in Solderable Isotropic Conductive Adhesives (ICAs)
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Published:2008-06
Issue:
Volume:580-582
Page:213-216
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ISSN:1662-9752
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Container-title:Materials Science Forum
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language:
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Short-container-title:MSF
Author:
Lee Seong Hyuk1,
Lee Jung Hee2,
Lee Jin Woon1,
Kim Jong Min1
Affiliation:
1. Chung-Ang University
2. Function Bay Inc. Industrial Bank
Abstract
A new hybrid soldering and conductive adhesive joining technology using a fusible lowmelting-
point alloy (LMPA) have been developed. A numerical method for numerical analysis of
fusible particles behavior is proposed to investigate coalescence characteristics of fusible particles
in solderable isotropic conductive adhesives (ICAs). For finding out suitable conditions to obtain
reliable conduction paths, the present study examines the influence of process-related parameters
such as volume fraction and viscosity on coalescence characteristics of fusible particles.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
1 articles.
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