Experimental Analysis for the Low-Temperature Growth of Poly-Si Films by Using Double Excimer Laser
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Published:2008-08
Issue:
Volume:594
Page:299-305
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ISSN:1662-9752
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Container-title:Materials Science Forum
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language:
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Short-container-title:MSF
Author:
Chao Long Sun1,
Chen Yu Ru2
Affiliation:
1. National Cheng Kung University
2. Industrial Technology Research Institute
Abstract
This paper is to investigate a double splitting excimer laser technique for making poly Si
films. In this research, a KrF excimer laser of 248 nm in wavelength is used to irradiate a-Si films of
0.1 m in thickness on glass substrate to produce poly-Si ones. The control parameters are laser
intensity (200~500 mJ/cm2), laser pulse number (1~2 shots) and delay time between two shots (one
nanosecond). Average grain sizes from SEM photos are used to analyze the effects of these
parameters. Firstly, in the excimer laser experiment, different laser fluences are utilized to study the
effect on the microstructure of the silicon film. Purely from the viewpoint of heat transfer, the Si film
obtains more energy has the slower cooling or solidification rate, which results in the larger grain.
From the experimental results, it can be found that the grain size increases until the laser fluence
increases up to the critical value of complete melting, which limits the grain growth method of energy
increase. In this work, a double-splitting-laser method is proposed. In the method, a laser pulse from
an excimer laser is divided into two pulses by a beam splitter. The cyclic optical path is used to control
the delay time of the second pulse. Optical mirrors and optical attenuators are utilized to adjust the
energy density of these two laser pulses. The delay time between these two pulses is changeable and
controlled in the order of nanosecond. The second pulse is applied when the Si film is solidifying after
the irradiation of the first one. This could enhance the solidification time and enlarge the grain size of
the poly-Si film.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science