Joining of Tungsten-Copper Using Pulse Electric Current Sintering Method
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Published:2005-12
Issue:
Volume:502
Page:443-448
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ISSN:1662-9752
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Container-title:Materials Science Forum
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language:
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Short-container-title:MSF
Author:
Fukuzawa Yasushi1,
Nagasawa Shigeru1,
Watanabe Masahiro,
Takaoka Shigehiko1
Affiliation:
1. Nagaoka University of Technology
Abstract
To develop the new bonding method under low bonding temperature and short holding duration, pulse electric current sintering (PECS) method is applied. The Ni plating layer was used as the interlayer. The following experimental factors were researched:(1) Thickness of Ni plating layer, (2) Bonding temperature, (3) Bonding pressure and (4) Heat treatment after plating. The bonding strength of W-Ni plate-Cu joint could be obtained under low bonding temperature of 773 K and short bonding duration of 10 min.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference3 articles.
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