Affiliation:
1. National Technical University of Athens
2. Technical University of Lisbon (TU Lisbon)
Abstract
For silver plating, mainly silver cyanide solutions are used and this is extensively treated
in the literature. Yet, in view of the growing concern for environmental problems, they will have to
be replaced because of their toxic properties. In the present work, the appropriateness of thiosulphate
) O S ( 2
3 2
− , a complexing agent for silver of common use in photographic applications, as
an alternative for cyanide in electroplating baths is investigated. The kinetic characteristics of the
reduction are determined, since they fix at which rate the plating can proceed. Prior to the kinetic
study, requiring measurements in solutions of varying composition, the thermodynamic data on
complex formation between Ag+ and − 2
3 2O S ions are analysed. And finally, the composition and
the morphology of the silver deposits are examined as a function of the plating conditions.
Electrochemical and analytical physical techniques are used.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
3 articles.
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