Miniature Stress Test of Miniature Components Based on Piezoresistive Stress Sensors Test Circuit

Author:

Wang Xiao Dong1,Qin Yong Jian1,Luo Yi1

Affiliation:

1. Dalian University of Technology

Abstract

In this work, piezoresistive stress sensors test circuit fabricated into the sensitive structure as part of the normal processing procedure is used to measure the stresses difference distribution before and after the assembly. Sensor resistances were recorded before and after the adhesive bonding. Using the theoretical equations, the stresses on the die surface have been calculated from the data of sensor resistances. This technology not only provides a performance diagnostic tool for the sensitive structures and the miniature components, but also presents a design tool for low-stress micro-assemblies of miniature components.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. On chip micro stress test circuit for miniature component;Ninth International Symposium on Precision Engineering Measurement and Instrumentation;2015-03-06

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