Frequency Bandwidth Adjustment by Precision Post-Processing for a 0.78–0.95 THz Band SIS Mixer-Reference-Cited by-同舟云学术

Frequency Bandwidth Adjustment by Precision Post-Processing for a 0.78–0.95 THz Band SIS Mixer

Published:2015-05 Issue: Volume:643 Page:157-163
ISSN:1662-9795
Container-title:Key Engineering Materials
language:
Short-container-title:KEM

Author:

Miyachi Akihira¹,Kojima Takafumi¹,Fujii Yasunori¹,Takeda Masanori²,Uzawa Yoshinori¹,Kroug Matthias¹,Noguchi Takashi¹

Affiliation:

1. National Astronomical Observatory of Japan

2. Shizuoka University

Abstract

In this study, we demonstrate a method for adjusting the frequency bandwidth of a Superconductor-insulator-superconductor (SIS) mixer device by controlling its thickness after microfabrication. We estimate the relationship between SIS mixer device thickness and frequency bandwidth using electromagnetic (EM) simulation. We propose an optimal method for the precision polishing of the back side of the device. We evaluate the noise temperature and measure the frequency bandwidth of SIS mixer devices with different thicknesses. This study presents the adjustment of the frequency bandwidth of a device through controlling its thickness after microfabrication. This technique may improve the yield of SIS mixer device mass production and support the construction of receivers for ultra-high frequencies such as Atacama Large Millimeter/Submillimeter Array (ALMA) Band 10.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.scientific.net/KEM.643.157.pdf

Reference18 articles.

1. Information on http: /www. almaobservatory. org.

2. S. Asayama, S. Kawashima, H. Iwashita, T. Takahashi, M. Inata, Y. Obuchi, T. Suzuki, T. Wada: Proc. of the 19th Int. Sympo. on Space Terahertz Technology, ISSTT (2008), p.244.

3. W. Shan, S. Asayama, M. Kamikura, T. Noguchi, S. Shi, Y. Sekimoto: IEICE Trans. on Electronics Vol. E89-C, Issue 2 (2006), p.170.

4. W. Shan, T. Noguchi, S. Shi, Y. Sekimoto: IEEE Trans. on Appl. Supercond. Vol. 15, Issue 2　(2005), p.503.

5. Y. Uzawa, M. Kroug, T. Kojima, M. Takeda, M. Candotti, Y. Fujii, K. Kaneko, W. Shan, T. Noguchi, Z. Wang: Supercond. Sci. Technol. Vol. 22 (2009), p.114002.