Optical Part Measuring inside a Milling Machine

Author:

Meier Nicolas1,Georgiadis Anthimos1

Affiliation:

1. Leuphana University of Lüneburg

Abstract

The dimensions of a workpiece have been measured during the milling process using a 3D laser inspection system. Re-clamping of the work piece has been avoided but a short interruption of the milling process took place. All three dimensions of the part have been measured, height and width using a profile scanning devise based on the laser triangulation method and the length using also the displacement features of the machine tool. Gauge blocks with the reference dimension of 4, 8, 10, 14, 18 and 23 mm have been used for the verification of the measurements. The measured values for the height deviate from the real value between 0 to 19 μm. The deviations of the length lie between 0 and 33 μm. The deviations of the width are higher and they lie between 0 and 150 μm, because of the scanning steps of the devise. The measurement of the width could be improved using a second scanner perpendicular to the first one in order to achieve an overall part inspection with deviations lower than 33 μm.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference5 articles.

1. M. Glück, Die Produktion 2020, Computer & Automation (2012), Nr. 6, S. 47–50.

2. R. Schmitt, M. Harding, J. Lose, C. Mersmann, P. Jatzkowski, Anforderungen der Produktion, Verein Deutscher Ingenieure e.V. (Hrsg. ), Fertigungsmesstechnik 2020 : Technologie-Roadmap für die Messtechnik in der industriellen Produktion, S. 19. Düsseldorf : VDI/VDE, (2011).

3. W. Osten, E. Garbusi, D. Fleischle, W. Lyda, C. Pruss, R. Reichle, C. Falldorf, Optical metrology from the laboratory to the real world, Proc. of SPIE 7387 (2010).

4. W. Lyda, D. Fleischle, M. Gronie, F. Mauch, K. Körner, W. Osten, Herausforderungen und Lösungsansätze für die fertigungsnahe Qualitätskontrolle mittels optischer 3D-Messtechnik, 16. GMA/ITG-Fachtagung Sensoren und Messsysteme (2012).

5. Keyence Corporation of America, High-speed Inline Profile Measurement Device: LJ-V7000 Series, Elmwood Park, (2012).

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