Sapphire Substrate Ring-Belt Magnetorheological Polishing Processing

Abstract

Using the ring-belt magnetorheological polishing equipment to do polishing experiments on sapphire substrate, analyzed the influence of the main process parameters on polishing, focus on the influence of the polishing liquid PH value on material removal. Experimental results show that, with the increase of the PH value of the polishing liquid, sapphire substrate material removal rate increased, the roughness value was convergence trend, roughness will increases when the PH value is greater than 12.5. In optimal conditions, the maximum material removal rate of sapphire substrate was 5.6μm/h, after polishing the original surface roughness was decreased from 11nm to 0. 84nm. The ring-belt magnetorheological finishing applicable to sapphire efficient and ultra-smooth processing.